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The WQ7033AX Bluetooth Audio SoC contains 3 RISC-V CPUs, built in a HiFi-5 DSP with an NPU. It supports classic Bluetooth and Bluetooth LE 5.2 dual mode, and the new generation of Bluetooth Audio technology standard. The WQ7033 also supports FF+FB mixed ANC (Active Noise Cancellation) with less than 6 μs ADC to DAC latency, and hearing pass through, and VAD voice wake-up. It provides rich interfaces, high level of integration, suitable for advanced TWS noise reduction headphones and many other products that demand sophisticated audio processing and voice AI capabilities.
  • Package : QFN
  • Size : 4 mm x 6.4 mm
  • PIN : 50
WQ7100 is 2.4 GHz wireless SoC chip with high cost effective, high performance, high integration, and ultra-low power consumption. This multi-functional SoC chip supports EDR/BLE Bluetooth 5.0 dual mode module and provides flexibility for creating advanced IoT applications, such as electronic price tags, wireless security products, remote control, smart home nodes, and remote connection sensors.
  • Package : QFN
  • Size : 5 mm x 5 mm
  • PIN : 48
The WQ3100 is the companion Analog Front End (AFE) Integrated Circuit (IC) that interfaces between the WQ3001 media access control and physical link layer (MAC and PHY) IC and the powerline (PL) filtering and coupling network.The WQ3100 provides amplification, signal conditioning, and level translation for both transmit (TX) and receive (RX) functions.
  • Package : QFN
  • Size : 4 mm x 4 mm
  • PIN : 24
The WQ3011 chip integrates two high performance 32-bit CPU, a flexible and reliable PLC MAC, a PLC PHY that is based on the OFDM modulation-demodulation, a high performance and cost-effective AFE, and rich peripheral interfaces (such as the UART, SPI, I2C, I2S, and GPIO interfaces). The WQ3011 can support the mesh network via any type of AC/DC power lines (110/220VAC 50/60Hz) and can support power measurement with ± 1% accuracy as well.
  • Package : QFN
  • Size : 6 mm x 6 mm
  • PIN : 48
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