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The WQ7033AX Bluetooth Audio SoC contains 3 RISC-V CPUs, built in a HiFi-5 DSP with an NPU. It supports classic Bluetooth and Bluetooth LE 5.2 dual mode, and the new generation of Bluetooth Audio technology standard. The WQ7033 also supports FF+FB mixed ANC (Active Noise Cancellation) with less than 6 μs ADC to DAC latency, and hearing pass through, and VAD voice wake-up. It provides rich interfaces, high level of integration, suitable for advanced TWS noise reduction headphones and many other products that demand sophisticated audio processing and voice AI capabilities.
  • Package : QFN
  • Size : 4 mm x 6.4 mm
  • PIN : 50
WQ7100 is 2.4 GHz wireless SoC chip with high cost effective, high performance, high integration, and ultra-low power consumption. This multi-functional SoC chip supports EDR/BLE Bluetooth 5.0 dual mode module and provides flexibility for creating advanced IoT applications, such as electronic price tags, wireless security products, remote control, smart home nodes, and remote connection sensors.
  • Package : QFN
  • Size : 5 mm x 5 mm
  • PIN : 48
WQ7003 is a Bluetooth SoC chip for wireless voice and audio applications. This chip consists of the EDR/BLE Bluetooth 5.0 dual mode module, two CPUs with DSP instructions, the high-performance audio codec subsystem that supports echo cancellation and noise reduction, the battery charging module, the ultra-low power management unit, and flexible IO peripheral controllers. WQ7003 provides a comprehensive solution to develop competitive headsets and speakers.
  • Package : QFN
  • Size : 5.6 mm x 4.6 mm
  • PIN : 48
The WQ3100 is the companion Analog Front End (AFE) Integrated Circuit (IC) that interfaces between the WQ3001 media access control and physical link layer (MAC and PHY) IC and the powerline (PL) filtering and coupling network.The WQ3100 provides amplification, signal conditioning, and level translation for both transmit (TX) and receive (RX) functions.
  • Package : QFN
  • Size : 4 mm x 4 mm
  • PIN : 24
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